Enthone Opens Semiconductor Applications Center in Taiwan

Enthone Inc.has announced the opening of its Semiconductor Applications Center in Taoyuan, Taiwan.

The Semiconductor Applications Center represents a multi-million dollar investment that further enables Enthone to deliver customer-driven solutions to the dynamic wafer fabrication marketplace. Technologies supported at the Center include the company's MICROFAB® bump wafer processes and ViaForm® wafer deposition electrodeposition technologies, including damascene copper, through silicon via (TSV), copper redistribution layer (RDL), copper post, and lead-free bump applications.

Raymond Fong, Vice President and Managing Director – Enthone Asia said, ''Taiwan represents over 65% of the world's semiconductor foundry manufacturing, as well as 60% of the world's semiconductor packaging market. The Center is strategically located to further support and collaborate with these world leaders on new and emerging technologies as they advance their product portfolio, and implement higher performance, more cost-effective wafer manufacturing throughout the Asia-Pacific region and across the globe.''


 
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